Direct Optoelectronic Imaging of 2D Semiconductor–3D Metal Buried Interfaces-Reference-Cited by-同舟云学术

Direct Optoelectronic Imaging of 2D Semiconductor–3D Metal Buried Interfaces

Published:2021-03-08 Issue:3 Volume:15 Page:5618-5630
ISSN:1936-0851
Container-title:ACS Nano
language:en
Short-container-title:ACS Nano

Author:

Jo Kiyoung¹^ORCID,Kumar Pawan¹²^ORCID,Orr Joseph³,Anantharaman Surendra B.¹,Miao Jinshui¹,Motala Michael J.⁴⁵,Bandyopadhyay Arkamita²^ORCID,Kisslinger Kim⁶,Muratore Christopher⁷^ORCID,Shenoy Vivek B.²,Stach Eric A.²^ORCID,Glavin Nicholas R.⁴^ORCID,Jariwala Deep¹^ORCID

Affiliation:

1. Electrical and Systems Engineering, University of Pennsylvania, Philadelphia, Pennsylvania 19104, United States

2. Materials Science and Engineering, University of Pennsylvania, Philadelphia, Pennsylvania 19104, United States

3. Electrical and Computer Engineering, Villanova University, Villanova, Pennsylvania 19085, United States

4. Air Force Research Laboratory, Materials and Manufacturing Directorate, Wright-Patterson AFB, Ohio 45433, United States

5. UES Inc., Beavercreek, Ohio 45432, United States

6. Brookhaven National Laboratory, Upton, New York 11973, United States

7. University of Dayton, Dayton, Ohio 45469, United States

Funder

Schweizerischer Nationalfonds zur Förderung der Wissenschaftlichen Forschung

Army Research Office

Air Force Office of Scientific Research

Brookhaven National Laboratory

National Science Foundation

Division of Materials Research

Publisher

American Chemical Society (ACS)

Subject

General Physics and Astronomy,General Engineering,General Materials Science

Link

https://pubs.acs.org/doi/pdf/10.1021/acsnano.1c00708

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