Formation of Nanoporous Nickel by Selective Anodic Etching of the Nobler Copper Component from Electrodeposited Nickel−Copper Alloys-Reference-Cited by-同舟云学术

Formation of Nanoporous Nickel by Selective Anodic Etching of the Nobler Copper Component from Electrodeposited Nickel−Copper Alloys

Published:2008-01-15 Issue:5 Volume:112 Page:1371-1376
ISSN:1932-7447
Container-title:The Journal of Physical Chemistry C
language:en
Short-container-title:J. Phys. Chem. C

Author:

Chang Jeng-Kuei¹,Hsu Shih-Hsun¹,Sun I-Wen¹,Tsai Wen-Ta¹

Affiliation:

1. Department of Materials Science and Engineering, National Cheng Kung University, Tainan, Taiwan, and Department of Chemistry, National Cheng Kung University, Tainan, Taiwan

Publisher

American Chemical Society (ACS)

Subject

Surfaces, Coatings and Films,Physical and Theoretical Chemistry,General Energy,Electronic, Optical and Magnetic Materials

Link

https://pubs.acs.org/doi/pdf/10.1021/jp0772474

Reference24 articles.

1. Alloy Corrosion

2. Selective Anodic Dissolution of Cu‐Au Alloys: TEM and Current Transient Study

3. Electrochemical and Scanning Tunneling Microscopic Study of Dealloying of Cu3Au

4. Corrosion micromorphology of noble metal alloys and depletion gilding

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