High Thermoelectric Performance in the New Cubic Semiconductor AgSnSbSe3 by High-Entropy Engineering-Reference-Cited by-同舟云学术

High Thermoelectric Performance in the New Cubic Semiconductor AgSnSbSe3 by High-Entropy Engineering

Published:2020-08-04 Issue:35 Volume:142 Page:15187-15198
ISSN:0002-7863
Container-title:Journal of the American Chemical Society
language:en
Short-container-title:J. Am. Chem. Soc.

Author:

Luo Yubo¹²^ORCID,Hao Shiqiang,Cai Songting^ORCID,Slade Tyler J.^ORCID,Luo Zhong Zhen²,Dravid Vinayak P.^ORCID,Wolverton Chris^ORCID,Yan Qingyu²^ORCID,Kanatzidis Mercouri G.^ORCID

Affiliation:

1. State Key Laboratory of Materials Processing and Die & Mould Technology, School of Materials Science and Engineering, Huazhong University of Science and Technology, Wuhan 430074, P. R. China

2. School of Materials Science and Engineering, Nanyang Technological University, 50 Nanyang Avenue, Singapore 639798, Singapore

Funder

Agency for Science, Technology and Research

Ministry of Education of the People's Republic of China

Basic Energy Sciences

National Natural Science Foundation of China

Science and Engineering Research Council

Publisher

American Chemical Society (ACS)

Subject

Colloid and Surface Chemistry,Biochemistry,General Chemistry,Catalysis

Link