Interfacial Engineering in Solution Processing of Silicon-Based Hybrid Multilayer for High Performance Thin Film Encapsulation
Author:
Affiliation:
1. Innovation Center for Organic Electronics (INOEL), Yamagata University, Arcadia 1-808-48, Yonezawa, Yamagata 992-0119, Japan
2. Graduate School of Science and Engineering, Yamagata University, Jonan 4-3-16, Yonezawa, Yamagata 992-8510, Japan
Funder
Center of Innovation Program
Publisher
American Chemical Society (ACS)
Subject
General Materials Science
Link
http://pubs.acs.org/doi/pdf/10.1021/acsami.9b14994
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