Decomposition of Packaging Materials and Recycling GaAs from Waste ICs by Hydrothermal Treatment-Reference-Cited by-同舟云学术

Decomposition of Packaging Materials and Recycling GaAs from Waste ICs by Hydrothermal Treatment

Published:2019-07-22 Issue:16 Volume:7 Page:14111-14118
ISSN:2168-0485
Container-title:ACS Sustainable Chemistry & Engineering
language:en
Short-container-title:ACS Sustainable Chem. Eng.

Author:

Zhang Yongliang¹,Zhan Lu²¹³^ORCID,Xie Bing¹³^ORCID,Xu Zhenming²³^ORCID,Chen Chao¹

Affiliation:

1. Shanghai Key Lab for Urban Ecological Processes and Eco-Restoration, School of Ecological and Environmental Science, East China Normal University, 500 Dongchuan Road, Shanghai 200241, China

2. School of Environmental Science and Engineering, Shanghai Jiao Tong University, 800 Dongchuan Road, Shanghai 200240, China

3. Shanghai Institute of Pollution Control and Ecological Security, 1515 North Zhongshan Road, Shanghai 200092, China

Funder

Science and Technology Commission of Shanghai Municipality

National Natural Science Foundation of China

Publisher

American Chemical Society (ACS)

Subject

Renewable Energy, Sustainability and the Environment,General Chemical Engineering,Environmental Chemistry,General Chemistry

Link

https://pubs.acs.org/doi/pdf/10.1021/acssuschemeng.9b02724

Reference32 articles.

1. A study on the recycling of scrap integrated circuits by leaching

2. E-waste: a problem or an opportunity? Review of issues, challenges and solutions in Asian countries

3. Recycling Arsenic from Gallium Arsenide Scraps through Sulfurizing Thermal Treatment

4. China National Bureau of Statistics Web page. http://www.stats.gov.cn/tjsj/zxfb/201902/t20190228_1651265.html (accessed March 13, 2019).

5. Gallium: the backbone of the electronics industry

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