Moisture Ingress at the Molecular Scale in Hygrothermal Aging of Fiber–Epoxy Interfaces
Author:
Affiliation:
1. Institute for Frontier Materials, Deakin University, Geelong, VIC 3216, Australia
Funder
Australian Research Council
Office of Naval Research Global
Publisher
American Chemical Society (ACS)
Subject
General Materials Science
Link
https://pubs.acs.org/doi/pdf/10.1021/acsami.0c17027
Reference70 articles.
1. Fibre reinforced composites in aircraft construction
2. Review of advanced composite structures for naval ships and submarines
3. Epoxy-water interactions
4. Mechanical properties and failure behaviour of carbon fibre-reinforced polymer composites under the influence of moisture
5. The effect of the moisture absorption on the interfacial strength of polymeric matrix composites
Cited by 33 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. Intelligent fibers and textiles for wearable biosensors;Responsive Materials;2024-09-08
2. Deterioration of carbon fiber/matrix interface in humid environments and influence of silicon coupling agent modification: An atomistic investigation;Composite Structures;2024-09
3. Damage behavior of carbon fiber electrothermal adhesive films after long-term electrothermal and hygrothermal aging treatment;Colloids and Surfaces A: Physicochemical and Engineering Aspects;2024-08
4. Hygrothermal effect and statistical analysis of the interfacial performance of nano and microscale polymer composites;Composite Interfaces;2024-07-04
5. Enhanced interfacial, mechanical, and anti-hygrothermal properties of carbon fiber/cyanate ester composites with the catalytic sizing agents of titanium epoxy;Composites Science and Technology;2024-07
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3