Enhancing Thermal Interface Conductance to Graphene Using Ni–Pd Alloy Contacts-Reference-Cited by-同舟云学术

Enhancing Thermal Interface Conductance to Graphene Using Ni–Pd Alloy Contacts

Author:

Saha Dipanjan¹,Yu Xiaoxiao²,Du Yanhao³,Guo Zhitao²,Xiong Feng³,Gellman Andrew J.²⁴^ORCID,Malen Jonathan A.¹^ORCID

Affiliation:

1. Department of Mechanical Engineering, Carnegie Mellon University, Pittsburgh, Pennsylvania 15213, United States

2. Department of Chemical Engineering, Carnegie Mellon University, Pittsburgh, Pennsylvania 15213, United States

3. Department of Electrical and Computer Engineering, University of Pittsburgh, Pittsburgh, Pennsylvania 15261, United States

4. W. E. Scott Institute for Energy Innovation, Carnegie Mellon University, Pittsburgh, Pennsylvania 15213, United States

Funder

Division of Chemistry

Army Research Office

Mascaro Center for Sustainable Innovation, University of Pittsburgh

Division of Electrical, Communications and Cyber Systems

Publisher

American Chemical Society (ACS)

Subject

General Materials Science

Link

Reference60 articles.

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