Highly Conductive Collagen by Low-Temperature Atomic Layer Deposition of Platinum

Author:

Bishal Arghya K.1,Anderson Nickolas D.1ORCID,Ho Hung Sai Ken2,Jokisaari Jacob R.3,Klie Robert F.3ORCID,Koh Ahyeon2ORCID,Abdussalam Wildan4,Sukotjo Cortino5,Takoudis Christos G.16ORCID

Affiliation:

1. Department of Bioengineering, University of Illinois at Chicago, 851 S. Morgan Street, Chicago, Illinois 60607, United States

2. Department of Biomedical Engineering, The State University of New York at Binghamton University, P.O. Box 6000, Binghamton, New York 13902, United States

3. Department of Physics, University of Illinois at Chicago, 845 W. Taylor Street, Chicago, Illinois 60607, United States

4. Helmholtz Zentrum Dresden Rossendorf, Bautzner Landstrasse 400, 01328 Dresden, Germany

5. Department of Restorative Dentistry, University of Illinois at Chicago, 801 S. Paulina Street, Chicago, Illinois 60612, United States

6. Department of Chemical Engineering, University of Illinois at Chicago, 851 S. Morgan Street, Chicago, Illinois 60607, United States

Funder

Division of Materials Research

Publisher

American Chemical Society (ACS)

Subject

General Materials Science

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