Statistical Analysis of Plating Variable Effects on the Electrical Conductivity of Electroless Copper Patterns on Paper
Author:
Affiliation:
1. U.S. Naval Research Laboratory, Center for Bio/Molecular Science & Engineering, Code 6910, 4555 Overlook Avenue S.W., Washington, D.C. 20375, United States
Publisher
American Chemical Society (ACS)
Subject
General Materials Science
Link
https://pubs.acs.org/doi/pdf/10.1021/am3006934
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