Cu Ion Ink for a Flexible Substrate and Highly Conductive Patterning by Intensive Pulsed Light Sintering-Reference-Cited by-同舟云学术

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Cu Ion Ink for a Flexible Substrate and Highly Conductive Patterning by Intensive Pulsed Light Sintering

Published:2013-04-30 Issue:10 Volume:5 Page:4113-4119
ISSN:1944-8244
Container-title:ACS Applied Materials & Interfaces
language:en
Short-container-title:ACS Appl. Mater. Interfaces

Author:

Wang Byung-Yong¹²,Yoo Tae-Hee¹,Song Yong-Won¹,Lim Dae-Soon²,Oh Young-Jei¹³

Affiliation:

1. Future Convergence Technology Research Division, Korea Institute of Science and Technology, Seoul 136-791, Republic of Korea

2. Division of Materials Science and Engineering, Korea University, Seoul 136-701, Republic of Korea

3. Department of Nano Material Science and Engineering, University of Science and Technology, Deajeon 305-333, Republic of Korea

Publisher

American Chemical Society (ACS)

Subject

General Materials Science

Link

https://pubs.acs.org/doi/pdf/10.1021/am303268k

Reference27 articles.

1. Printed electronics: the challenges involved in printing devices, interconnects, and contacts based on inorganic materials

2. Organic materials for printed electronics

3. High-Resolution Inkjet Printing of All-Polymer Transistor Circuits

4. Microwave Flash Sintering of Inkjet-Printed Silver Tracks on Polymer Substrates

5. Inkjet printed polymer light-emitting devices fabricated by thermal embedding of semiconducting polymer nanospheres in an inert matrix

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2. Solvent-free Cu sintering pastes using acidic activators;Microelectronics Reliability;2024-08

3. Room temperature compressed air-stable conductive copper films for flexible electronics;npj Flexible Electronics;2024-07-27

4. Enhanced Anti-Oxidation Copper-Based Conductive Inks for Low Porosity Copper Films in Power Electronics;IEEE Transactions on Components, Packaging and Manufacturing Technology;2024-07

5. Insight into the Types of Alkanolamines on the Properties of Copper(II) Formate-Based Conductive Ink;Langmuir;2024-03-21

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