Molecular Events for an Epoxy–Amine System at a Copper Interface-Reference-Cited by-同舟云学术

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Molecular Events for an Epoxy–Amine System at a Copper Interface

Published:2020-02-28 Issue:4 Volume:2 Page:1474-1481
ISSN:2637-6105
Container-title:ACS Applied Polymer Materials
language:en
Short-container-title:ACS Appl. Polym. Mater.

Author:

Yamamoto Satoru¹²,Kuwahara Riichi³,Aoki Mika¹,Shundo Atsuomi¹⁴⁵^ORCID,Tanaka Keiji¹²⁴⁵^ORCID

Affiliation:

1. Department of Applied Chemistry, Kyushu University, Fukuoka 819-0395, Japan

2. Center for Polymer Interface and Molecular Adhesion Science, Kyushu University, Fukuoka 819-0395, Japan

3. Dassault Systèmes K. K., Tokyo 141-6020, Japan

4. Department of Automotive Science, Kyushu University, Fukuoka 819-0395, Japan

5. International Institute for Carbon-Neutral Energy Research (WPI-I2CNER), Kyushu University, Fukuoka 819-0395, Japan

Funder

Japan Science and Technology Agency

Publisher

American Chemical Society (ACS)

Subject

Organic Chemistry,Polymers and Plastics,Process Chemistry and Technology

Link

https://pubs.acs.org/doi/pdf/10.1021/acsapm.9b01154

Reference45 articles.

1. Accelerated microwave curing of fibre-reinforced thermoset polymer composites for structural applications: A review of scientific challenges

2. Synthesis and application of epoxy-ended hyperbranched polymers

3. Synthesis and characterization of petroleum and biobased epoxy resins: a review

4. Recent advances in carbon-fiber-reinforced thermoplastic composites: A review

5. A review of extending performance of epoxy resins using carbon nanomaterials

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