Magnetically Oriented 3D-Boron Nitride Nanobars Enable Efficient Heat Dissipation for 3D-Integrated Power Packaging-Reference-Cited by-同舟云学术

Magnetically Oriented 3D-Boron Nitride Nanobars Enable Efficient Heat Dissipation for 3D-Integrated Power Packaging

Published:2023-09-19 Issue:19 Volume:6 Page:18508-18517
ISSN:2574-0970
Container-title:ACS Applied Nano Materials
language:en
Short-container-title:ACS Appl. Nano Mater.

Author:

Wang Jian¹²³^ORCID,Yang Chao¹²³,Ma Dezhi¹²³,Zhang Mowen¹²,Li Xing¹²,Li Zhiqiang³,He Zhiyuan²,Liu Linhua¹³,Fu Zhiwei¹²,Yang Jia-Yue¹³^ORCID

Affiliation:

1. School of Energy and Power Engineering, Shandong University, Jinan 250100, China

2. Science and Technology on Reliability Physics and Application of Electronic Component Laboratory, China Electronic Product Reliability and Environmental Testing Research Institute, Guangzhou 510610, China

3. Optics & Thermal Radiation Research Center, Institute of Frontier and Interdisciplinary Science, Shandong University, Qingdao 266237, China

Funder

National Key Research and Development Program of China

Special Project for Research and Development in Key areas of Guangdong Province

National Natural Science Foundation of China

Publisher

American Chemical Society (ACS)

Subject

General Materials Science

Link

https://pubs.acs.org/doi/pdf/10.1021/acsanm.3c03969

Reference55 articles.

1. Enhanced Thermal Conductivity in a Hybrid Graphite Nanoplatelet – Carbon Nanotube Filler for Epoxy Composites

2. Effects of chemical bonding on heat transport across interfaces

3. Enhancement of Thermal Energy Transport Across Graphene/Graphite and Polymer Interfaces: A Molecular Dynamics Study

4. Emerging challenges and materials for thermal management of electronics

5. The chips are down for Moore’s law

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