Nickel Nanoparticle/Carbon Films as an Interlayer To Improve the Stability of Solder Joints-Reference-Cited by-同舟云学术

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Nickel Nanoparticle/Carbon Films as an Interlayer To Improve the Stability of Solder Joints

Published:2023-03-29 Issue:7 Volume:6 Page:5844-5852
ISSN:2574-0970
Container-title:ACS Applied Nano Materials
language:en
Short-container-title:ACS Appl. Nano Mater.

Author:

Lu Guoge¹,Lin Bo¹,Gao Zhan¹,Zhang Weiyi¹,Li Yingxin¹,Wei Fuxiang¹²^ORCID,Sui Yanwei¹²^ORCID,Qi Jiqiu¹²,Meng Qingkun¹²,Ren Yaojian¹²

Affiliation:

1. School of Materials and Physics, China University of Mining & Technology, Xuzhou 221116, P. R. China

2. Jiangsu Province Engineering Laboratory of High Efficient Energy Storage Technology and Equipments, China University of Mining & Technology, Xuzhou 221116, P. R. China

Funder

Central University Basic Research Fund of China

Publisher

American Chemical Society (ACS)

Subject

General Materials Science

Link

https://pubs.acs.org/doi/pdf/10.1021/acsanm.3c00234

Reference38 articles.

1. Effect of Nanoparticles Addition on the Microstructure and Properties of Lead-Free Solders: A Review

2. Effect of graphene nano-sheets additions on the density, hardness, conductivity, and corrosion behavior of Sn–0.7Cu solder alloy

3. Properties and Microstructures of Sn-Ag-Cu-X Lead-Free Solder Joints in Electronic Packaging

4. Properties of lead-free solder alloys with rare earth element additions

5. Effect of nano-ZnO particles on wettability, interfacial morphology and growth kinetics of Sn–3.0Ag–0.5Cu–xZnO composite solder

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