Enhancement of Mechanical Properties of High-Thermal-Conductivity Composites Comprising Boron Nitride and Poly(methyl methacrylate) Resin through Material Design Utilizing Hansen Solubility Parameters-Reference-Cited by-同舟云学术

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Enhancement of Mechanical Properties of High-Thermal-Conductivity Composites Comprising Boron Nitride and Poly(methyl methacrylate) Resin through Material Design Utilizing Hansen Solubility Parameters

Published:2024-05-09 Issue:20 Volume:16 Page:26653-26663
ISSN:1944-8244
Container-title:ACS Applied Materials & Interfaces
language:en
Short-container-title:ACS Appl. Mater. Interfaces

Author:

Inagaki Yumi¹^ORCID,Murase Masakazu¹^ORCID,Tanaka Hiromitsu¹^ORCID,Nakamura Daisuke¹^ORCID

Affiliation:

1. Toyota Central R&D Laboratories, Inc., Nagakute, Aichi 480-1192, Japan

Publisher

American Chemical Society (ACS)

Link

https://pubs.acs.org/doi/pdf/10.1021/acsami.4c00626

Reference40 articles.

1. Thermal management of electronics: A review of literature

2. A review of dielectric polymer composites with high thermal conductivity

3. Investigation of thermal management materials for automotive electronic control units

4. Thermal Transport of AlN/Graphene/3C-SiC Typical Heterostructures with Different Crystallinities of Graphene

5. Thermal conductivities and mechanical properties of AlN ceramics fabricated by three dimensional printing

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