Enhancing the Delamination Efficiency of Polyimide–Copper Bilayers with UV/Heat-Activated Foamable Adhesive: Insights and Applications-Reference-Cited by-同舟云学术

Enhancing the Delamination Efficiency of Polyimide–Copper Bilayers with UV/Heat-Activated Foamable Adhesive: Insights and Applications

Published:2024-06-08 Issue:24 Volume:16 Page:31788-31797
ISSN:1944-8244
Container-title:ACS Applied Materials & Interfaces
language:en
Short-container-title:ACS Appl. Mater. Interfaces

Author:

Khawdas Wichean¹^ORCID,Sawada Yuko¹,Miyata Ken²,Okamura Haruyuki³,Taki Kentaro⁴^ORCID,Ito Hiroshi¹^ORCID

Affiliation:

1. Research Center for GREEN Materials and Advanced Processing, Yamagata University, Yonezawa, Yamagata 992-8510, Japan

2. Department of Organic Materials Science, Graduate School of Organic Materials Science, Yamagata University, Yonezawa, Yamagata 992-8510, Japan

3. Department of Applied Chemistry Graduate School of Engineering, Osaka Metropolitan University, Sakai, Osaka 599-8531, Japan

4. Department of Frontier Engineering, Kanazawa University, Kakuma-machi, Kanazawa, Ishikawa 920-1192, Japan

Funder

Core Research for Evolutional Science and Technology

Publisher

American Chemical Society (ACS)

Link

https://pubs.acs.org/doi/pdf/10.1021/acsami.4c04417

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