Synergistic Tailoring of Electronic and Thermal Transports in Thermoelectric Se-Free n-Type (Bi,Sb)<sub>2</sub>Te<sub>3</sub>-Reference-Cited by-同舟云学术

Synergistic Tailoring of Electronic and Thermal Transports in Thermoelectric Se-Free n-Type (Bi,Sb)₂Te₃

Published:2024-06-29 Issue:30 Volume:16 Page:39356-39366
ISSN:1944-8244
Container-title:ACS Applied Materials & Interfaces
language:en
Short-container-title:ACS Appl. Mater. Interfaces

Author:

Jung Soo-ho¹²^ORCID,Jo Seungki¹,Song Kyung³,Choi Eun Ae⁴^ORCID,Bae Jinhee¹,Park Jong Min¹,Hwang Seong-Mee⁵,Sun Jeong-Yun²^ORCID,Kim Hyun-Sik⁵^ORCID,Kim Kyung Tae¹^ORCID

Affiliation:

1. Department of 3D Printing Materials, Korea Institute of Materials Science, 797 Changwon-daero, Seongsan-gu, Gyeongsannam-do 51508, Republic of Korea

2. Research Institute of Advanced Materials, Seoul National University1 Gwanak-ro 599, Gwanak-gu, Seoul 151-742, Republic of Korea

3. Department of Materials Characterization, Korea Institute of Materials Science, 797 Changwon-daero, Seongsan-gu, Gyeongsangnam-do 51508, Republic of Korea

4. Department of Special Alloys, Korea Institute of Materials Science, 797 Changwon-daero, Seongsan-gu, Gyeongsangnam-do 51508, Republic of Korea

5. Department of Materials Science and Engineering, University of Seoul, 232 Gongneung-ro, Nowon-gu, Seoul 01811, Republic of Korea

Funder

Korea Institute of Materials Science

National Research Foundation of Korea

Publisher

American Chemical Society (ACS)

Link

https://pubs.acs.org/doi/pdf/10.1021/acsami.4c06978

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