Electrical Contact at the Interface between Silicon and Transfer-Printed Gold Films by Eutectic Joining
Author:
Affiliation:
1. Department of Mechanical Science and Engineering, University of Illinois at Urbana−Champaign, Urbana, Illinois 61801, United States
2. Department of Chemical and Materials Engineering, University of Alberta, Edmonton, Alberta T6G 2V4, Canada
Publisher
American Chemical Society (ACS)
Subject
General Materials Science
Link
https://pubs.acs.org/doi/pdf/10.1021/am4021236
Reference39 articles.
1. Transfer printing by kinetic control of adhesion to an elastomeric stamp
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5. Imbricate Scales as a Design Construct for Microsystem Technologies
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