Rearrangement of Rhenium Allyl Vinyl Ketone Complexes
Author:
Affiliation:
1. Department of Chemistry, University of Wisconsin, Madison, Wisconsin 53706
Publisher
American Chemical Society (ACS)
Subject
Inorganic Chemistry,Organic Chemistry,Physical and Theoretical Chemistry
Link
https://pubs.acs.org/doi/pdf/10.1021/om970004l
Reference17 articles.
1. Rearrangement of an allyl vinyl rhenium complex to a rhenium allyl vinyl ketone complex via two consecutive concerted organometallic rearrangements
2. Mechanism of rearrangement of an allylvinylrhenium complex to an (allyl vinyl ketone)rhenium complex: role of concerted organometallic reactions in avoiding high-energy coordinatively unsaturated intermediates
Cited by 5 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. Rhenium Compounds;Comprehensive Organometallic Chemistry III;2007
2. CC Bond-Forming Reactions of IrIII-Alkenyls and Nitriles or Aldehydes: Generation of Reactive Hydride- and Alkyl-Alkylidene Compounds and Observation of a Reversible 1,2-H Shift in Stable Hydride–IrIII Alkylidene Complexes;Chemistry - A European Journal;2002-11-15
3. Synthesis and Reactivity of [Ir(C2H4)2TpmMe2]PF6 (TpmMe2 = Tris(3,5-dimethylpyrazolyl)methane): Comparison with the Analogous TpMe2 Derivatives (TpMe2 = Hydrotris(3,5-dimethylpyrazolyl)borate);Organometallics;2001-12-06
4. Comparative chemistry of η3-oxaallyl and η3-allyl rhodium(I) complexes in the hydrosilylation of cyclopropyl ketones: observation of an unprecedented rearrangement;Journal of Organometallic Chemistry;1999-06
5. Synthesis and Structural Characterization of Stable Hydride−Alkylidene Complexes of Iridium(III);Organometallics;1998-08-19
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3