Magnetic Effect during Copper Electrodeposition: Diffusion Process Considerations
Author:
Affiliation:
1. DTI, CNRS-UMR 6107, Université de Reims, B.P. 1039, 51687 Reims Cedex 2, France
Publisher
American Chemical Society (ACS)
Subject
Materials Chemistry,Surfaces, Coatings and Films,Physical and Theoretical Chemistry
Link
https://pubs.acs.org/doi/pdf/10.1021/jp0305537
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