Thermally Controlled Acceleration of Epoxy Resin Curing through Polymer-Bound Imidazole Derivatives with High Latency
Author:
Affiliation:
1. Heinrich-Heine-University Düsseldorf, Institute of Organic and Macromolecular Chemistry, Universitätsstr. 1, 40225 Düsseldorf, Germany
2. tesa SE, Hugo-Kirchberg-Straße 1, 22848 Norderstedt, Germany
Funder
tesa SE
Publisher
American Chemical Society (ACS)
Subject
Organic Chemistry,Polymers and Plastics,Process Chemistry and Technology
Link
https://pubs.acs.org/doi/pdf/10.1021/acsapm.1c01568
Reference24 articles.
1. Synthesis and application of epoxy resins: A review
2. An overview of multifunctional epoxy nanocomposites
3. Shelf stability of reactive adhesive formulations: A case study for dicyandiamide-cured epoxy systems
4. Pham, H. Q.; Marks, M. J., Epoxy Resins. In Ullmann’s Encyclopedia of Industrial Chemistry.
5. Curing mechanism of epoxides by imidazoles
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