Simulation Study of the Effects of Interfacial Bonds on Adhesion and Fracture Behavior of Epoxy Resin Layers-Reference-Cited by-同舟云学术

Simulation Study of the Effects of Interfacial Bonds on Adhesion and Fracture Behavior of Epoxy Resin Layers

Author:

Miura Toshiaki¹^ORCID,Shimoi Yukihiro¹^ORCID,Hasegawa Koichi²,Takagi Kiyoka³,Yamazaki Noriko⁴,Matsuki Takeo¹,Harada Yoshihisa¹,Ohkubo Masataka¹

Affiliation:

1. National Institute of Advanced Industrial Science and Technology (AIST), 1-1-1 Umezono, Tsukuba, Ibaraki 305-8568, Japan

2. Research & Innovation Center, Mitsubishi Heavy Industries, Ltd., Nagoya, Aichi 455-8515, Japan

3. Fixed Wing Aircraft Engineering Department, Mitsubishi Heavy Industries, Ltd., Toyoyama, Aichi 480-0202, Japan

4. Research & Innovation Center, Mitsubishi Heavy Industries, Ltd., Yokohama, Kanagawa 220-8401, Japan

Funder

Acquisition, Technology and Logistics Agency

Publisher

American Chemical Society (ACS)

Subject

Materials Chemistry,Surfaces, Coatings and Films,Physical and Theoretical Chemistry

Link

Reference45 articles.

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