Effect of Cross-Linking Density on Horizontal and Vertical Shift Factors in Linear Viscoelastic Functions of Epoxy Resins-Reference-Cited by-同舟云学术

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Effect of Cross-Linking Density on Horizontal and Vertical Shift Factors in Linear Viscoelastic Functions of Epoxy Resins

Published:2021-10-05 Issue:20 Volume:54 Page:9618-9624
ISSN:0024-9297
Container-title:Macromolecules
language:en
Short-container-title:Macromolecules

Author:

Shundo Atsuomi¹^ORCID,Aoki Mika²,Yamamoto Satoru²^ORCID,Tanaka Keiji¹²³^ORCID

Affiliation:

1. Department of Automotive Science, Kyushu University, Fukuoka 819-0395, Japan

2. Center for Polymer Interface and Molecular Adhesion Science, Kyushu University, Fukuoka 819-0395, Japan

3. Department of Applied Chemistry, Kyushu University, Fukuoka 819-0395, Japan

Funder

Japan Society for the Promotion of Science

Japan Science and Technology Agency

Publisher

American Chemical Society (ACS)

Subject

Materials Chemistry,Inorganic Chemistry,Polymers and Plastics,Organic Chemistry

Link

https://pubs.acs.org/doi/pdf/10.1021/acs.macromol.1c01293

Reference66 articles.

1. Thermal expansion and swelling of cured epoxy resin used in graphite/epoxy composite materials

2. Erasure Behavior of Isothermal Physical Aging Effect below Glass Transition Temperature in a Fully Cured Epoxy Resin. Differential Scanning Calorimetry Measurement

3. Homogeneously Dispersed Polyrotaxane in Epoxy Adhesive and Its Improvement in the Fracture Toughness

4. Understanding interfacial interaction characteristics of carbon nitride reinforced epoxy composites from atomistic insights

5. Epoxidized soybean oil grafted with CTBN as a novel toughener for improving the fracture toughness and mechanical properties of epoxy resin

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1. Effects of curing conditions on adhesive and fatigue properties of hydrogenated epoxy resins in bulk state and single-lap-joint configuration;International Journal of Adhesion and Adhesives;2024-06

2. Effect of Condensed Water at an Alumina/Epoxy Resin Interface on Curing Reaction;Langmuir;2024-05-20

3. Exploring the Impact of Molecular Structure on Curing Kinetics: A Comparative Study of Diglycidyl Ether of Bisphenol A and F Epoxy Resins;The Journal of Physical Chemistry B;2024-05-03

4. Electronic Interaction of Epoxy Resin with Copper at the Adhered Interface;Langmuir;2024-04-23

5. Modeling the cure shrinkage–induced warpage of epoxy molding compound;International Journal of Mechanical Sciences;2024-04

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