Soft Conductive Interfacing for Bioelectrical Uses: Adhesion Mechanisms and Structural Approaches

Author:

Kim Jaehyun1,Oh Joosung1,Park Yebin1,Kim Jae Joon2,Jeong Unyong1ORCID

Affiliation:

1. Department of Materials Science and Engineering, Pohang University of Science and Technology (POSTECH), 77 Cheongam-Ro, Nam-Gu, Pohang 37673, Gyeongbuk, Republic of Korea

2. Flexible Electronics Research Section, Reality Devices Research Division, Electronics and Telecommunications Research Institute (ETRI), 218 Gajeong-Ro, Yuseong-Gu, Daejeon 34129, Republic of Korea

Funder

Ministry of Science, ICT and Future Planning

Publisher

American Chemical Society (ACS)

Subject

Materials Chemistry,Inorganic Chemistry,Polymers and Plastics,Organic Chemistry

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