Synthesis of Superheat-Resistant Polyimides with High Tg and Low Coefficient of Thermal Expansion by Introduction of Strong Intermolecular Interaction
Author:
Affiliation:
1. School of Chemistry and Chemical Engineering, Shanghai Key Laboratory of Electrical Insulation and Thermal Aging, Shanghai Jiao Tong University, Shanghai 200240, China
Funder
Ministry of Science and Technology of the People's Republic of China
Shanghai Municipality
Publisher
American Chemical Society (ACS)
Subject
Materials Chemistry,Inorganic Chemistry,Polymers and Plastics,Organic Chemistry
Link
https://pubs.acs.org/doi/pdf/10.1021/acs.macromol.8b02282
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