Voltage-Activated Adhesion through Donor–Acceptor Dendrimers

Author:

Gan Lu1ORCID,Tan Nigel C. S.1,Shah Ankur Harish1,Webster Richard D.2ORCID,Gan Sher Li2,Steele Terry W. J.1ORCID

Affiliation:

1. School of Materials Science and Engineering (MSE), Division of Materials Technology, Nanyang Technological University (NTU), Singapore 639798

2. School of Physical and Mathematical Sciences (SPMS), Division of Chemistry and Biological Chemistry, Nanyang Technological University (NTU), Singapore 637371

Funder

Ministry of Education - Singapore

NTU-Northwestern Institute for Nanomedicine

Publisher

American Chemical Society (ACS)

Subject

Materials Chemistry,Inorganic Chemistry,Polymers and Plastics,Organic Chemistry

Reference104 articles.

1. Adhesives Market Gobal Breifing, https://www.giiresearch.com/report/tbrc535848-traditional-adhesive-dressings-market-global.html, Business Research Company, 2017.

2. Gillissen, S.; Nelis, E.; Wuytswinkel, G. v.; Pater, M. d.; Chih-Min, C.; Buffa, V.; Hara, W. O.; Bo, X.; Jayesh, S. Low Temperature Snap Cure Thermoset Adhesives with Good Worklife. 5th International Conference on Polymers and Adhesives in Microelectronics and Photonics, 2005; pp 166–170.

3. Carbon fiber composites cured by γ-radiation-induced polymerization of an epoxy resin matrix

4. Rizzolo, R.; Walczyk, D.; Kuppers, J. Rapid Consolidation and Curing of Advanced Composites with Electron Beam Irradiation. 30th Technical Conference of the American-Society-for-Composites; Destech Publications, Inc.: Lancaster, 2015; pp 25–38.

5. Development of soy-based UV-curable acrylate oligomers and study of their film properties

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