Effect of Solid–Liquid Interface Morphology on Grain Boundary Segregation during Colloidal Polycrystallization
Author:
Affiliation:
1. Institute for Materials Research (IMR), Tohoku University, Katahira 2-1-1, Aoba-ku, Sendai 980-8577, Japan
Funder
Japan Society for the Promotion of Science
China Scholarship Council
Publisher
American Chemical Society (ACS)
Subject
Condensed Matter Physics,General Materials Science,General Chemistry
Link
https://pubs.acs.org/doi/pdf/10.1021/acs.cgd.6b00066
Reference37 articles.
1. Experimental modelling of single-particle dynamic processes in crystallization by controlled colloidal assembly
2. Impurity effects on grain boundary migration
3. Bismuth-induced embrittlement of copper grain boundaries
4. Effect of Impurities on the Growth Kinetics of Crystals
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