Combination of Negative, Positive, and Near-Zero Thermal Expansion in Bis(imidazolium) Terephthalate with a Helical Hydrogen-Bonded Network-Reference-Cited by-同舟云学术

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Combination of Negative, Positive, and Near-Zero Thermal Expansion in Bis(imidazolium) Terephthalate with a Helical Hydrogen-Bonded Network

Published:2021-06-22 Issue:7 Volume:21 Page:3838-3849
ISSN:1528-7483
Container-title:Crystal Growth & Design
language:en
Short-container-title:Crystal Growth & Design

Author:

Zięba Sylwia¹,Gzella Andrzej²,Dubis Alina T.³,Łapiński Andrzej¹^ORCID

Affiliation:

1. Institute of Molecular Physics, Polish Academy of Sciences, M. Smoluchowskiego 17, 60-179 Poznań, Poland

2. Department of Organic Chemistry, Poznan University of Medical Sciences, Grunwaldzka 6, 60-780 Poznań, Poland

3. Department of Chemistry, University of Bialystok, Ciołkowskiego 1K, 15-245 Białystok, Poland

Funder

Ministerstwo Nauki i Szkolnictwa Wy??szego

Publisher

American Chemical Society (ACS)

Subject

Condensed Matter Physics,General Materials Science,General Chemistry

Link

https://pubs.acs.org/doi/pdf/10.1021/acs.cgd.1c00167

Reference98 articles.

1. ISOTROPIC NEGATIVE THERMAL EXPANSION

2. Negative thermal expansion materials †

3. Negative thermal expansion

4. Negative thermal expansion: a review

5. Colossal Positive and Negative Thermal Expansion in the Framework Material Ag 3 [Co(CN) 6 ]

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1. Structural Design and Energy and Environmental Applications of Hydrogen‐Bonded Organic Frameworks: A Systematic Review;Advanced Science;2024-04-22

2. Helical model of compression and thermal expansion;Scientific Reports;2023-10-13

3. Ultra-High Proton Conductivity iHOF Based on Guanidinium Arylphosphonate for Proton Exchange Membrane Fuel Cells;Chemistry of Materials;2023-04-03

4. Biaxial Negative Thermal Expansion in an Organic Imidazolium Salt: Modulation of the Thermal Expansion Property by Methyl Substitution;Crystal Growth & Design;2023-02-20

5. Tuning of thermal expansion properties of a mixed-ligand MOF by ligand variation;CrystEngComm;2023

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