Controllable Crystallographic Texture in Copper Foils Exhibiting Enhanced Mechanical and Electrical Properties by Pulse Reverse Electrodeposition-Reference-Cited by-同舟云学术

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Controllable Crystallographic Texture in Copper Foils Exhibiting Enhanced Mechanical and Electrical Properties by Pulse Reverse Electrodeposition

Published:2015-08-18 Issue:9 Volume:15 Page:4448-4458
ISSN:1528-7483
Container-title:Crystal Growth & Design
language:en
Short-container-title:Crystal Growth & Design

Author:

Pavithra Chokkakula L. P.¹²,Sarada Bulusu V.¹,Rajulapati Koteswararao V.²,Ramakrishna M¹,Gundakaram Ravi C.¹,Rao Tata N.¹,Sundararajan G.¹

Affiliation:

1. International Advanced Research Centre for Powder Metallurgy and New Materials (ARCI), Balapur (P.O), Hyderabad 500005, India

2. School of Engineering Sciences and Technology (SEST), University of Hyderabad (UoH), Gachibowli, Hyderabad 500046, India

Publisher

American Chemical Society (ACS)

Subject

Condensed Matter Physics,General Materials Science,General Chemistry

Link

https://pubs.acs.org/doi/pdf/10.1021/acs.cgd.5b00748

Reference93 articles.

1. Ultrahigh Strength and High Electrical Conductivity in Copper

2. Revealing the Maximum Strength in Nanotwinned Copper

3. Strengthening Materials by Engineering Coherent Internal Boundaries at the Nanoscale

4. Electromigration in copper conductors

5. Havemann, R. H.; Hutchby, J. A.InHigh-Performance Interconnects: An Integration Overview; Proceedings of the IEEE, 2001;IEEE:New York, 2001; pp586–601.

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