Chemical Environment of Copper Aggregates Embedded in Polypyrrole Films: The Nature of the Copper−Polypyrrole Interaction-Reference-Cited by-同舟云学术

Chemical Environment of Copper Aggregates Embedded in Polypyrrole Films: The Nature of the Copper−Polypyrrole Interaction

Published:2002-10-01 Issue:43 Volume:106 Page:11102-11107
ISSN:1520-6106
Container-title:The Journal of Physical Chemistry B
language:en
Short-container-title:J. Phys. Chem. B

Author:

Watanabe N.¹,Morais J.¹,Alves ¹

Affiliation:

1. Laboratório Nacional de Luz Síncrotron, P.O. Box 6192, 13084−971, Campinas, Brazil, Instituto de Química, UNICAMP, P.O. Box 6154, 13083-970, Campinas, Brazil, and Instituto de Física, Universidade Federal do Rio Grande do Sul, Av. Bento Gonçalves, 9500, 91501−970, Porto Alegre, Brazil

Publisher

American Chemical Society (ACS)

Subject

Materials Chemistry,Surfaces, Coatings and Films,Physical and Theoretical Chemistry

Link

https://pubs.acs.org/doi/pdf/10.1021/jp013940u

Reference39 articles.

1. Electrodeposition of platinum microparticles into polyaniline films with electrocatalytic applications

2. Electrochemical inclusion of metallic clusters in organic conducting polymers An in situ dispersive x-ray absorption study

3. Electrocatalytic oxidation of methanol and C1 molecules on highly dispersed electrodes Part II: Platinum-ruthenium in polyaniline

4. Dispersive X-Ray Spectroscopy for Time-ResolvedIn SituObservation of Electrochemical Inclusion of Metallic Clusters within a Conducting Polymer

5. Cyclic Voltammetry of Electrodeposition of Metal on Electrosynthesized Polypyrrole Film

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