Molecular-Scale Change in the Surface Properties of Silica and Copper in Pure Water with Time-Reference-Cited by-同舟云学术

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Molecular-Scale Change in the Surface Properties of Silica and Copper in Pure Water with Time

Published:2010-09-03 Issue:19 Volume:26 Page:15310-15315
ISSN:0743-7463
Container-title:Langmuir
language:en
Short-container-title:Langmuir

Author:

McNamee Cathy E.¹,Nakayama Masaki²,Higashitani Ko³

Affiliation:

1. Shinshu University, Tokida 3-15-1, Ueda-shi, Nagano-ken 386-8567, Japan

2. Mitsubishi Rayon Co., 10-1, Daikoku-cho, Tsurumi-ku, Yokohama 230-0053, Japan

3. Graduate School of Engineering, Kyoto University - Katsura, Nishikyo-ku, Kyoto, Kyoto 615-8530, Japan

Publisher

American Chemical Society (ACS)

Subject

Electrochemistry,Spectroscopy,Surfaces and Interfaces,Condensed Matter Physics,General Materials Science

Link

https://pubs.acs.org/doi/pdf/10.1021/la1020934

Reference31 articles.

1. CMP Fill Synthesis: A Survey of Recent Studies

2. Chemical Mechanical Planarization of Copper: Role of Oxidants and Inhibitors

3. A Model of Copper CMP

4. SURFACE CHEMISTRY AND TRIBOLOGY OF MEMS

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3. Effect of the Charge and Roughness of Surfaces on Normal and Friction Forces Measured in Aqueous Solutions;Langmuir;2013-04-11

4. Use of attractive forces to create a self-assembled film of charged nano-particles with a controlled packing;Colloids and Surfaces A: Physicochemical and Engineering Aspects;2012-03

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