Generalized Kinetic Master Plots for the Thermal Degradation of Polymers Following a Random Scission Mechanism
Author:
Affiliation:
1. Instituto de Ciencia de Materiales de Sevilla, CSIC-Universidad de Sevilla, C. Américo Vespucio No. 49, 41092 Sevilla, Spain
Publisher
American Chemical Society (ACS)
Subject
Physical and Theoretical Chemistry
Link
https://pubs.acs.org/doi/pdf/10.1021/jp103171h
Reference53 articles.
1. Solid-State Kinetic Models: Basics and Mathematical Fundamentals
2. A physico-geometric approach to the kinetics of solid-state reactions as exemplified by the thermal dehydration and decomposition of inorganic solids
3. The Application of Thermoanalytical Techniques to Reaction Kinetics: The Thermogravimetric Evaluation of the Kinetics of the Decomposition of Calcium Oxalate Monohydrate
4. Interpretation of the kinetics of thermogravimetric analysis
Cited by 87 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. Mesoscale modeling of random chain scission in polyethylene melts;Journal of Physics: Materials;2024-07-01
2. Preparation and Reactivity of Core–Shell Al@CL-20 Composites Embedded with Graphene-Based Complexes as Catalysts;Langmuir;2024-05-02
3. Effect of nanoclay on the thermal degradation kinetics of recycled biodegradable/non-biodegradable polymer blends using the random chain-scission model;Journal of Analytical and Applied Pyrolysis;2024-01
4. The thermodynamics and kinetics of depolymerization: what makes vinyl monomer regeneration feasible?;Chemical Science;2024
5. Insights into the 5,5′-bis(1H-tetrazolyl)amine monohydrate (BTA·H2O) pyrolysis mechanism: integrated experimental and kinetic model analysis;New Journal of Chemistry;2024
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3