Probing Molecular Structures of Poly(dimethylsiloxane) at Buried Interfaces in Situ-Reference-Cited by-同舟云学术

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Probing Molecular Structures of Poly(dimethylsiloxane) at Buried Interfaces in Situ

Published:2013-02-19 Issue:8 Volume:117 Page:3903-3914
ISSN:1932-7447
Container-title:The Journal of Physical Chemistry C
language:en
Short-container-title:J. Phys. Chem. C

Author:

Zhang Chi¹,Chen Zhan¹

Affiliation:

1. Department of Chemistry, University of Michigan, 930 North University Avenue, Ann Arbor, Michigan 48109, United States

Publisher

American Chemical Society (ACS)

Subject

Surfaces, Coatings and Films,Physical and Theoretical Chemistry,General Energy,Electronic, Optical and Magnetic Materials

Link

https://pubs.acs.org/doi/pdf/10.1021/jp307472j

Reference61 articles.

1. Adhesion and Adhesives

2. Adhesive bonding in microelectronics and photonics

3. Mine, K.; Nishio, M.; Sumimura, S.Heat Curable Organopolysiloxane Compositions Containing Adhesion Additives. U.S. Patent 4,033,924, July 5, 1977.

4. Schulz, J. R.Self-Adhering Silicone Compositions and Preparations Thereof. U.S. Patent 4,087,585, May 2, 1978.

5. Gray, T. E.; Lutz, M. A.Curable Organopolysiloxane Compositions with Improved Adhesion. U.S. Patent 5,595,826, Jan 21, 1997.

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