Highly Conductive Ag Paste for Recoverable Wiring and Reliable Bonding Used in Stretchable Electronics-Reference-Cited by-同舟云学术

Highly Conductive Ag Paste for Recoverable Wiring and Reliable Bonding Used in Stretchable Electronics

Author:

Li Cai-Fu¹^ORCID,Li Wanli¹²^ORCID,Zhang Hao¹,Jiu Jinting¹³,Yang Yang¹⁴^ORCID,Li Lingying¹²,Gao Yue¹²,Liu Zhi-Quan¹⁵,Suganuma Katsuaki¹

Affiliation:

1. The Institute of Scientific and Industrial Research, Osaka University, Ibaraki 567-0047, Japan

2. Department of Adaptive Machine Systems, Graduate School of Engineering, Osaka University, Suita 565-0871, Japan

3. Senju Metal Industry Co., Ltd., Tokyo 120-8555, Japan

4. Pacific Northwest National Laboratory, Richland, Washington 99354, United States

5. Institute of Metal Research, Chinese Academy of Sciences, Shenyang 110016, China

Funder

Ministry of Education, Culture, Sports, Science and Technology

Huawei Technologies

Japan Society for the Promotion of Science

Publisher

American Chemical Society (ACS)

Subject

General Materials Science

Link

Reference51 articles.

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