Hydrogen Bond-Regulated Boron Nitride Network Structures for Improved Thermal Conductive Property of Polyamide-imide Composites-Reference-Cited by-同舟云学术

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Hydrogen Bond-Regulated Boron Nitride Network Structures for Improved Thermal Conductive Property of Polyamide-imide Composites

Published:2018-04-12 Issue:19 Volume:10 Page:16812-16821
ISSN:1944-8244
Container-title:ACS Applied Materials & Interfaces
language:en
Short-container-title:ACS Appl. Mater. Interfaces

Author:

Jiang Fang,Cui Siqi,Song Na^ORCID,Shi Liyi,Ding Peng^ORCID

Funder

Natural Science Foundation of Shanghai

PetroChina Innovation Foundation

Science and Technology Commission of Shanghai Municipality

National Natural Science Foundation of China

Development Fund for Shanghai Talents

Publisher

American Chemical Society (ACS)

Subject

General Materials Science

Link

https://pubs.acs.org/doi/pdf/10.1021/acsami.8b03522

Reference61 articles.

1. Thermal conductivity of polymer-based composites: Fundamentals and applications

2. Guest Editorial: Thermally conductive but electrically insulating materials for highvoltage applications

3. A Combination of Boron Nitride Nanotubes and Cellulose Nanofibers for the Preparation of a Nanocomposite with High Thermal Conductivity

4. A review on thermally conductive polymeric composites: classification, measurement, model and equations, mechanism and fabrication methods

5. High thermal conductivity in amorphous polymer blends by engineered interchain interactions

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