A Novel Method for the Metallization of 3D Silicon Induced by Metastable Copper Nanoparticles-Reference-Cited by-同舟云学术

A Novel Method for the Metallization of 3D Silicon Induced by Metastable Copper Nanoparticles

Author:

Cure J.¹²,Piettre K.¹²,Sournia-Saquet A.¹,Coppel Y.¹,Esvan J.³,Chaudret B.⁴^ORCID,Fau P.¹^ORCID

Affiliation:

1. LCC−CNRS, Université de Toulouse, CNRS, UPS, 205 route de Narbonne BP 44099, Toulouse 31077, France

2. STMicroelectronics SAS, 10 impasse Thales de Millet, Tours 37070, France

3. CIRIMAT-ENSIACET, Université de Toulouse, CNRS, UPS, 4 allée Emile Monso BP 44362, Toulouse 31030, France

4. LPCNO, Université de Toulouse, CNRS, INSA, UPS, 135 avenue de Rangueil, Toulouse 31077, France

Funder

Universit? de Toulouse

Association Nationale de la Recherche et de la Technologie

Centre National de la Recherche Scientifique

STMicroelectronics

Institut National des Sciences Appliqu?es Toulouse

Publisher

American Chemical Society (ACS)

Subject

General Materials Science

Link

Reference30 articles.

2. Paolo Gargini, ITRS–Past, Present, and Future; https:/www.itrs.net/itrs-reports.html (accessed January 2018).

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