Metallic Bond-Enabled Wetting Behavior at the Liquid Ga/CuGa2 Interfaces
Author:
Affiliation:
1. School of Future Technology, University of Chinese Academy of Sciences, Beijing 100049, China
2. Department of Biomedical Engineering, School of Medicine, Tsinghua University, Beijing 100084, China
Funder
National Natural Science Foundation of China
Chinese Academy of Sciences
Publisher
American Chemical Society (ACS)
Subject
General Materials Science
Link
https://pubs.acs.org/doi/pdf/10.1021/acsami.8b00009
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