Abatement of PFCs from Semiconductor Manufacturing Processes by Nonthermal Plasma Technologies: A Critical Review
Author:
Affiliation:
1. Graduate Institute of Environmental Engineering, National Central University, Chung-Li 32054, Taiwan, and McIARS and Department of Engineering Physics, McMaster University, Hamilton, Ontario, Canada L8S 4M1
Publisher
American Chemical Society (ACS)
Subject
Industrial and Manufacturing Engineering,General Chemical Engineering,General Chemistry
Link
https://pubs.acs.org/doi/pdf/10.1021/ie051227b
Reference65 articles.
1. Coburn, J. W.Plasma etching and reactive ion etching; American Vacuum Society Monograph Series; American Institute of Physics: New York, 1982; p 2.
2. Fundamental processes of SF/sub 6/ decomposition and oxidation in glow and corona discharges
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