High Out-of-Plane Thermally Conductive Polyimide Film for Electronic Thermal Management by the Incorporation of Core–Shell Ag/Polyimide Microparticles-Reference-Cited by-同舟云学术

High Out-of-Plane Thermally Conductive Polyimide Film for Electronic Thermal Management by the Incorporation of Core–Shell Ag/Polyimide Microparticles

Published:2023-05-17 Issue:6 Volume:5 Page:4224-4232
ISSN:2637-6105
Container-title:ACS Applied Polymer Materials
language:en
Short-container-title:ACS Appl. Polym. Mater.

Author:

Wang Yanyan¹,Liu Shuaishuai²,Xiao Chao¹,Jiang Miao¹,Ding Xin¹,Zhang Hui²^ORCID,Zheng Kang¹^ORCID,Chen Lin¹,Tian Xingyou¹,Zhang Xian¹^ORCID

Affiliation:

1. Key Laboratory of Photovoltaic and Energy Conservation Materials, Institute of Solid State Physics, Hefei Institutes of Physical Science, Chinese Academy of Sciences, Hefei 230031, People’s Republic of China

2. School of Materials Science & Engineering, Anhui University, Hefei 230601, People’s Republic of China

Funder

Hefei Institutes of Physical Science, Chinese Academy of Sciences

National Natural Science Foundation of China

Anhui Province

Publisher

American Chemical Society (ACS)

Subject

Organic Chemistry,Polymers and Plastics,Process Chemistry and Technology

Link

https://pubs.acs.org/doi/pdf/10.1021/acsapm.3c00442

Reference39 articles.