Novel Dual-Curing Process for a Stereolithographically Printed Part Triggers a Remarkably Improved Interlayer Adhesion and Excellent Mechanical Properties
Author:
Affiliation:
1. RIAM, Department of Materials Science and Engineering, College of Engineering, Seoul National University, Kwanakro 1, Kwanakgu, Seoul 08826, Republic of Korea
Funder
Korea Research Institute of Chemical Technology
Posco
Center for Iron and Steel Research at Research Institute of Advanced Materials, Seoul National University
Institute of Engineering Research, Seoul National University
Publisher
American Chemical Society (ACS)
Subject
Electrochemistry,Spectroscopy,Surfaces and Interfaces,Condensed Matter Physics,General Materials Science
Link
https://pubs.acs.org/doi/pdf/10.1021/acs.langmuir.0c01553
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