Electroless Copper Plating on a Cotton Surface: Effect of Metal Ion Ligand Stability Constant on Reduction Deposition-Reference-Cited by-同舟云学术

Electroless Copper Plating on a Cotton Surface: Effect of Metal Ion Ligand Stability Constant on Reduction Deposition

Published:2024-07-22 Issue:31 Volume:40 Page:16283-16290
ISSN:0743-7463
Container-title:Langmuir
language:en
Short-container-title:Langmuir

Author:

Jiang Tao¹²,Wan Jiajia¹²,Zong Yuting¹²,Gui Chengmei¹^ORCID,Chen Zhenming¹²,Huang Junjun¹²^ORCID

Affiliation:

1. Guangxi Key Laboratory of Calcium Carbonate Resources Comprehensive Utilization, College of Materials and Chemical Engineering, Hezhou University, Hezhou City, 542899, China

2. School of Energy Materials and Chemical Engineering, Hefei University, Hefei City, 230601, China

Funder

Natural Science Foundation of Guangxi Zhuang Autonomous Region

National Natural Science Foundation of China

Guangxi Science and Technology Base and Special Talents Program

Publisher

American Chemical Society (ACS)

Link

https://pubs.acs.org/doi/pdf/10.1021/acs.langmuir.4c01455

Reference28 articles.

1. Selective adsorption of catalyst and copper plating for additive fabrication of conductive patterns and through-holes

2. A facile process combined with inkjet printing, surface modification and electroless deposition to fabricate adhesion-enhanced copper patterns on flexible polymer substrates for functional flexible electronics

3. Region-selective electroless gold plating on polycarbonate sheets by UV-patterning in combination with silver activating

4. Electrophoretic deposition of graphene oxide on continuous carbon fibers for reinforcement of both tensile and interfacial strength

5. Molecular orbital study on the reaction process of dimethylamine borane as a reductant for electroless deposition