Metal Microcapsules Prepared via Electroless Plating at Liquid–Liquid Interface-Reference-Cited by-同舟云学术

Metal Microcapsules Prepared via Electroless Plating at Liquid–Liquid Interface

Published:2019-09-25 Issue:41 Volume:35 Page:13311-13317
ISSN:0743-7463
Container-title:Langmuir
language:en
Short-container-title:Langmuir

Author:

Tsuneyoshi Toshihiko¹,Cui Yunlong¹,Ishida Hiroaki¹,Watanabe Takaichi¹,Ono Tsutomu¹^ORCID

Affiliation:

1. Department of Applied Chemistry, Graduate School of Natural Science and Technology, Okayama University, 3-1-1, Tsushima-Naka, Kita-Ku, Okayama 700-8530, Japan

Funder

Japan Society for the Promotion of Science

Publisher

American Chemical Society (ACS)

Subject

Electrochemistry,Spectroscopy,Surfaces and Interfaces,Condensed Matter Physics,General Materials Science

Link

https://pubs.acs.org/doi/pdf/10.1021/acs.langmuir.9b00181

Reference61 articles.

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3. Assembly of Latex Particles by Using Emulsion Droplets as Templates. 1. Microstructured Hollow Spheres

4. Assembly of Latex Particles by Using Emulsion Droplets as Templates. 2. Ball-like and Composite Aggregates

5. Assembly of Latex Particles by Using Emulsion Droplets. 3. Reverse (Water in Oil) System

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