High-Performance, Solution-Processed, Embedded Multiscale Metallic Transparent Conductors-Reference-Cited by-同舟云学术

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High-Performance, Solution-Processed, Embedded Multiscale Metallic Transparent Conductors

Published:2016-04-22 Issue:17 Volume:8 Page:10937-10945
ISSN:1944-8244
Container-title:ACS Applied Materials & Interfaces
language:en
Short-container-title:ACS Appl. Mater. Interfaces

Author:

Oh Yong Suk¹,Lee Hyunwoo²,Choi Dong Yun¹,Lee Sung-Uk¹,Kim Hojin³,Yoo Seunghyup²,Park Inkyu¹,Sung Hyung Jin¹

Affiliation:

1. Department of Mechanical Engineering, KAIST, 291 Daehak-ro, Yuseong-gu, Daejeon 34141, Korea

2. Department of Electrical Engineering, KAIST, 291 Daehak-ro, Yuseong-gu, Daejeon 34141, Korea

3. Department of Mechanical Engineering, POSTECH, 77 Cheongam-ro, Pohang, Kyungbuk 37673, Korea

Funder

National Research Foundation of Korea

Ministry of Trade, Industry and Energy

Publisher

American Chemical Society (ACS)

Subject

General Materials Science

Link

https://pubs.acs.org/doi/pdf/10.1021/acsami.6b02333

Reference48 articles.

1. Highly Efficient and Bendable Organic Solar Cells with Solution-Processed Silver Nanowire Electrodes

2. Nanoimprinted Semitransparent Metal Electrodes and Their Application in Organic Light-Emitting Diodes

3. Nonvacuum, Maskless Fabrication of a Flexible Metal Grid Transparent Conductor by Low-Temperature Selective Laser Sintering of Nanoparticle Ink

4. The Race To Replace Tin-Doped Indium Oxide: Which Material Will Win?

5. Highly Conductive and Transparent PEDOT:PSS Films with a Fluorosurfactant for Stretchable and Flexible Transparent Electrodes

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3. Simple Isopropanol-Assisted Direct Soft Imprint Lithography for Residue-Free Microstructure Patterning;ACS Applied Materials & Interfaces;2024-05-17

4. One-Step Nanoscale Patterning of Silver Ionic Ink via Elastic Mold Deformation;JOURNAL OF SENSOR SCIENCE AND TECHNOLOGY;2023-07-31

5. Simultaneous Laser Sintering and Embedding of Silver Nanoparticles to Fabricate Highly Flexible Embedded Electrodes;2023

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