Hierarchical Assembly of Tungsten Spheres and Epoxy Composites in Three-Dimensional Graphene Foam and Its Enhanced Acoustic Performance as a Backing Material-Reference-Cited by-同舟云学术

Hierarchical Assembly of Tungsten Spheres and Epoxy Composites in Three-Dimensional Graphene Foam and Its Enhanced Acoustic Performance as a Backing Material

Published:2016-07-08 Issue:28 Volume:8 Page:18496-18504
ISSN:1944-8244
Container-title:ACS Applied Materials & Interfaces
language:en
Short-container-title:ACS Appl. Mater. Interfaces

Author:

Qiu Yunfeng¹,Liu Jingjing¹,Lu Yue¹,Zhang Rui²,Cao Wenwu³,Hu PingAn¹

Affiliation:

1. State Key Laboratory of Robotics and System (HIT), Harbin 150080, P.R. China

2. Condensed Matter Science and Technology Institute, Harbin Institute of Technology, Harbin 150080, China

3. Department of Mathematics and Materials Research Institute, The Pennsylvania State University, University Park, Pennsylvania 16802, United States

Funder

Ministry of Science and Technology of the People's Republic of China

National Natural Science Foundation of China

State Key Laboratory of Robotics and System, Harbin Institute of Technology

Publisher

American Chemical Society (ACS)

Subject

General Materials Science

Link

https://pubs.acs.org/doi/pdf/10.1021/acsami.6b06024

Reference35 articles.

1. Acoustic properties of particle/polymer composites for ultrasonic transducer backing applications

2. Highly attenuative rubber modified epoxy for ultrasonic transducer backing applications

3. A novel ultrasonic transducer backing from porous epoxy resin–titanium–silane coupling agent and plasticizer composites

4. Experimental and simulated performance of lithium niobate 1–3 piezocomposites for 2MHz non-destructive testing applications

5. Effect of Inter-Rod Coupling on 1-3 Piezocomposite High-Power Ultrasonic Transducers

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