Affiliation:
1. Department
of Mechanical and Process Engineering, ETH Zurich, 8092 Zurich, Switzerland
Funder
Division of Graduate Education
Division of Chemical, Bioengineering, Environmental, and Transport Systems
Publisher
American Chemical Society (ACS)
Subject
General Materials Science
Reference70 articles.
1. The intrinsic thermal conductivity of AIN
2. Mohammed, A. C.; Corbett, S. J.Thick Film Metallizations and Performance of a Power Hybrid Module on Aluminum Nitride Substrates.InProceedings of the International Symposium on Microelectronics, International Society of Hybrid Microelectronics, Anaheim, CA, November 11–14, 1985;International Society for Hybrid Microelectronics:Reston, VA, 1985; 218.
3. Effective Sintering Aids for Low-temperature Sintering of AlN Ceramics
4. Weimer, A. W.Carbide, Nitride and Boride Materials Synthesis and Processing;Springer:The Netherlands, 1997; p696.
5. Aluminum Nitride-An Alternative Ceramic Substrate for High Power Applications in Microcircuits
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