Prediction of the Wetting Behavior of Active and Hole-Transport Layers for Printed Flexible Electronic Devices Using Molecular Dynamics Simulations
Author:
Affiliation:
1. Air Force Research Laboratory, Wright Patterson AFB, Ohio 45433, United States
2. UES Inc., 4401 Dayton-Xenia Road, Dayton, Ohio 45432, United States
Funder
Air Force Research Laboratory
Publisher
American Chemical Society (ACS)
Subject
General Materials Science
Link
https://pubs.acs.org/doi/pdf/10.1021/acsami.6b14786
Reference69 articles.
1. A maximum speed of wetting
2. A thermodynamic limitation on the maximum speed of wetting of a solid surface by a liquid
3. Additive manufacturing of metallic cellular materials via three-dimensional printing
4. Contact angle, adsorption and wettability — a review with respect to powders
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