Formation of Silicon-Based Molecular Electronic Structures Using Flip-Chip Lamination-Reference-Cited by-同舟云学术

Formation of Silicon-Based Molecular Electronic Structures Using Flip-Chip Lamination

Published:2009-08-11 Issue:34 Volume:131 Page:12451-12457
ISSN:0002-7863
Container-title:Journal of the American Chemical Society
language:en
Short-container-title:J. Am. Chem. Soc.

Author:

Coll Mariona¹,Miller Lauren H.¹,Richter Lee J.¹,Hines Daniel R.¹,Jurchescu Oana D.¹,Gergel-Hackett Nadine¹,Richter Curt A.¹,Hacker Christina A.¹

Affiliation:

1. Semiconductor Electronics Division, Electronics Electrical Engineering Laboratory and Surface and Microanalysis Science Division, Chemical Science and Technology Laboratory, National Institute of Standards and Technology, Gaithersburg, Maryland 20899, and Physics Department and Laboratory for Physical Sciences, University of Maryland, College Park, Maryland 20740

Publisher

American Chemical Society (ACS)

Subject

Colloid and Surface Chemistry,Biochemistry,General Chemistry,Catalysis

Link

https://pubs.acs.org/doi/pdf/10.1021/ja901646j

Reference80 articles.

1. Direct Covalent Grafting of Conjugated Molecules onto Si, GaAs, and Pd Surfaces from Aryldiazonium Salts

2. Electronic structure of a heterostructure of an alkylsiloxane self-assembled monolayer on silicon

3. Relationship between Leakage Current and the Type of Passivation Layer of Hydrogenated Amorphous Silicon Thin-Film Transistors

4. Ultralow-power organic complementary circuits

5. Sequential Reactions with Amine-Terminated Monolayers and Isolated Molecules on H/Si(111)

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