1. Key Laboratory of Intelligent Computing and Signal Processing of Ministry of Education, School of Integrated Circuits, Anhui University, Hefei 230601, China
2. College of Integrated Circuit Science and Engineering, Nanjing University of Posts and Telecommunications, Nanjing 210023, China
3. Key Laboratory of Integrated Circuit Manufacturing Technology, Chinese Academy of Sciences, Beijing 100029, China
4. Institute of Microelectronics, Chinese Academy of Sciences, Beijing 100029, China
5. JFS Laboratory, Wuhan, Hubei 430206, China
6. State Key Laboratory of High-Performance Precision Manufacturing, Dalian University of Technology, Dalian 116024, China
7. College of Materials and Environmental Engineering, Hangzhou Dianzi University, Hangzhou 310018, China
8. Frontier Institute of Chip and System, State Key Laboratory of Integrated Chips and Systems, Zhangjiang Fudan International Innovation Center, Fudan University, Shanghai 200433, China
9. School for Engineering of Matter, Transport and Energy, Arizona State University, Tempe, Arizona 85287, United States