Thermally Conductive Epoxy Resin Composites Based on 3D Graphene Nanosheet Networks for Electronic Package Heat Dissipation-Reference-Cited by-同舟云学术

Thermally Conductive Epoxy Resin Composites Based on 3D Graphene Nanosheet Networks for Electronic Package Heat Dissipation

Author:

Yan Zhengyang¹,Cai Xiaoming²,Liang Huiming³,Tang Junwen¹,Gou Quan¹,Wang Weiyao²,Gao Yu¹⁴,Qin Ming¹,Tan Honglin¹,Cai Jinming¹⁴^ORCID

Affiliation:

1. School of Materials Science and Engineering, Kunming University of Science and Technology, Kunming 650093, China

2. Faculty of Mechanical and Electrical Engineering, Kunming University of Science and Technology, Kunming 650021, China

3. Morion Nanotechnology Co., Ltd., Dongguan 523069, China

4. Southwest United Graduate School, Kunming 650000, China

Funder

Yunnan Provincial Department of Education

National Natural Science Foundation of China

Chinese Academy of Sciences

Yunnan Fundamental Research Projects

Yunnan Innovation Team of Graphene Mechanism Research and Application Industrialization

Reserve Talents for Yunnan Young and Middle-Aged Academic and Technical Leaders

Dongguan Innovation Research Team Program

Publisher

American Chemical Society (ACS)

Link

Reference53 articles.

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