Copper Better than Silver: Electrical Resistivity of the Grain-Free Single-Crystal Copper Wire-Reference-Cited by-同舟云学术

Copper Better than Silver: Electrical Resistivity of the Grain-Free Single-Crystal Copper Wire

Published:2010-04-26 Issue:6 Volume:10 Page:2780-2784
ISSN:1528-7483
Container-title:Crystal Growth & Design
language:en
Short-container-title:Crystal Growth & Design

Author:

Cho Yong Chan¹,Lee Seunghun²,Ajmal Muhammad¹,Kim Won-Kyung²,Cho Chae Ryong¹,Jeong Se-Young²,Park Jeung Hun³,Park Sang Eon⁴,Park Sungkyun⁵,Pak Hyuk-Kyu⁵,Kim Hyoung Chan⁶

Affiliation:

1. Department of Nano Fusion Technology, Pusan National University, Miryang, Korea

2. Department of Cogno-Mechatronics Engineering, Pusan National University, Miryang, Korea

3. Department of Materials Science & Engineering, University of California, Los Angeles, California 90095-1595

4. MCLAB Company Ltd., Pusan National University, Miryang, Korea

5. Department of Physics, Pusan National University, Busan, Korea

6. Division of R&D, National Fusion Research Institute, Daejon, Korea

Publisher

American Chemical Society (ACS)

Subject

Condensed Matter Physics,General Materials Science,General Chemistry

Link

https://pubs.acs.org/doi/pdf/10.1021/cg1003808

Reference25 articles.

1. Alteration of Cu conductivity in the size effect regime

2. Influence of phonon, geometry, impurity, and grain size on Copper line resistivity

3. Large Magnetoresistance of Electrodeposited Single-Crystal Bismuth Thin Films

4. The conductivity of thin metallic films according to the electron theory of metals

5. The mean free path of electrons in metals

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