Three Dimensional Architectures of Ultra-High Density Semiconducting Nanowires Deposited on Chip-Reference-Cited by-同舟云学术

Three Dimensional Architectures of Ultra-High Density Semiconducting Nanowires Deposited on Chip

Published:2003-04-26 Issue:20 Volume:125 Page:6284-6288
ISSN:0002-7863
Container-title:Journal of the American Chemical Society
language:en
Short-container-title:J. Am. Chem. Soc.

Author:

Ryan Kevin M.¹,Erts Donats¹,Olin Hakan¹,Morris Michael A.¹,Holmes Justin D.¹

Affiliation:

1. Contribution from the Department of Chemistry, Materials Section and Supercritical Fluid Centre, University College Cork, Cork, Ireland, Insitute of Chemical Physics, University of Latvia, Rainis Blvd, 19LV-1586 Riga, Latvia, and Physics and Engineering Physics, Chalmers University of Technology, SE−41296, Göteborg, Sweden.

Publisher

American Chemical Society (ACS)

Subject

Colloid and Surface Chemistry,Biochemistry,General Chemistry,Catalysis

Link

https://pubs.acs.org/doi/pdf/10.1021/ja0345064

Reference24 articles.

1. The future of equipment development and semiconductor production

2. Three-Dimensional Mesoscale Self-Assembly

3. Control of Thickness and Orientation of Solution-Grown Silicon Nanowires

4. Functional Nanoscale Electronic Devices Assembled Using Silicon Nanowire Building Blocks

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